发明名称 Charged particle beam lithography apparatus for forming pattern on semi-conductor
摘要 In order to provide a high-speed and high accuracy cell projection exposure apparatus which increases a pattern projection number extremely, a plurality of stencil masks mounting a transferal aperture and a transmission aperture are provided and are positioned by a drive stage, the electron beam passes through a transmission aperture of other stencil masks while selecting the aperture on a stencil mask with a beam deflection device, the transmission aperture is provided for a mask transfer direction in succession, the stencil mask is moved while being transmitted with the beam, and other stencil mask transfer is executed when specified stencil mask aperture group is exposed. These operations are repeated so that all exposure processes are performed.
申请公布号 US6583431(B2) 申请公布日期 2003.06.24
申请号 US20020105257 申请日期 2002.03.26
申请人 HITACHI, LTD. 发明人 ITO HIROYUKI;SOHDA YASUNARI;SOMEDA YASUHIRO;NAKAYAMA YOSHINORI;OKUMURA MASAHIDE;SATOH HIDETOSHI
分类号 G03F7/20;C08F10/02;G03F1/16;G03F1/20;H01J37/147;H01J37/317;H01L21/027;(IPC1-7):H01J37/304 主分类号 G03F7/20
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