| 摘要 |
A laminated semiconductor chip assembly fabricated by fixing back surfaces of first and second semiconductor chips, respectively having principal surfaces and back surfaces, to each other. Each of the principal surfaces of the laminated semiconductor chip assembly is fixed to a corresponding surface of a lead frame. A standing linear portion of a metallic wire on a ball bond side is pulled parallel to a side surface of the semiconductor chip in its thickness direction and a side surface of the inner lead in its thickness direction, and subjected to wire bonding. The formed semiconductor chip assembly is covered by a sealing resin so that an outer lead protrudes from the sealing resin. Thus, the semiconductor device can be made thin, cost can be reduced, and quality can be improved to increase capacities of electronic equipment.
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