BONDING MATERIAL, METHOD FOR DESIGNING BONDING MATERIAL AND BONDED STRUCTURE

摘要

PROBLEM TO BE SOLVED: To obtain a bonding material such as an anisotropically conductive material usable in COF (Chip on Flexible Printed circuit) packaging technology, which is able to correspond to the narrowing of an IC chip. SOLUTION: The bonding material which contains a thermosetting resin, a curing agent and an additive dispersed in the thermosetting resin as base materials has the maximum diameters of the curing agent and the additive smaller than the smallest distance between electrodes provided on a mounting body (for example, the IC chip) and the smallest distance between electrodes provided on a body to be mounted (for example, a flexible printed circuit board) to which the mounting body is bonded with the bonding material. COPYRIGHT: (C)2003,JPO