| 发明名称 |
Sequential build circuit board plating process |
| 摘要 |
A method for manufacture of a circuit method board which comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.
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| 申请公布号 |
US6582581(B1) |
申请公布日期 |
2003.06.24 |
| 申请号 |
US20000570281 |
申请日期 |
2000.05.12 |
| 申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
GOLDBERG ROBERT L.;SHIPLEY CHARLES R. |
| 分类号 |
C23C18/16;H05K1/02;H05K3/00;H05K3/18;H05K3/20;H05K3/46;(IPC1-7):C25D5/02 |
主分类号 |
C23C18/16 |
| 代理机构 |
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代理人 |
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