| 摘要 |
PROBLEM TO BE SOLVED: To provide a new adhesive sheet for a semiconductor device excellent in wire bonding properties, adhesive properties and solder heat resistance, and to provide a semiconductor device using the same. SOLUTION: An adhesive composition for a semiconductor device contains a polyester amide and a phenol resin in the adhesive as the indispensable components and the adhesive layer manifests≤40 of haze, and the adhesive sheet for the semiconductor device comprises the adhesive layer and at least an organic insulating film layer and contains the polyester amide and the phenol resin as the indispensable components and the adhesive layer manifests≤40 of haze. COPYRIGHT: (C)2003,JPO
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