| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when a die bonding film is fused and adhered to a semiconductor wafer held by a semiconductor wafer-protecting sheet after polishing the semiconductor wafer to be ultrathin, the semiconductor wafer is broken caused by softening of the semiconductor-protecting sheet by fusing heat and, when a hard support is adopted to protect the semiconductor wafer from breaking, the semiconductor wafer is broken caused by no reduction in stress during polishing. SOLUTION: This protecting sheet for semiconductor wafer comprises a support 1 comprising a single layer or multiple layers and an adhesive layer 2 laminated on the support 1. The support 1 has at least one heat resistant layer having 160-300°C melting point and 0.1-1.5 GPa tensile elastic modulus. COPYRIGHT: (C)2003,JPO
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