| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has excellent moldability and excellent solder-resistant reliability. SOLUTION: This epoxy resin composition for sealing semiconductors is characterized by comprising (A) (1) a dicyclopentadiene-modified phenol type epoxy resin and (2) a bisphenyl type epoxy resin in an amount of≥70 wt.% based on the total amount of the epoxy resins, (B) (3) a phenol novolak resin and (4) a phenol aralkyl resin in an amount of≥90 wt.% based on the total amount of the phenolic resins, (C) a curing accelerator and (D) an inorganic filler in an amount of 80 to 90 wt.% based on the total amount of the epoxy resins, in a [epoxy resin (1)]/[epoxy resin (2)] weight ratio of 30/70 to 70/30 and in a [phenolic resin (3)]/[phenolic resin (4)] weight ratio of 10/90 to 90/10. COPYRIGHT: (C)2003,JPO
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