发明名称 |
A semiconductor device having a plurality of semiconductor chips |
摘要 |
In a semiconductor device functioning as a three-dimensional device composed of two semiconductor chips bonded to each other, the back surface of the upper semiconductor chip is polished, the entire side surfaces of the upper semiconductor chip are covered with a resin layer, or the center portion of the upper semiconductor chip is formed to be thicker than the peripheral portion thereof. This suppresses the occurrence of a package crack and improves the reliability of the semiconductor device. |
申请公布号 |
US6583512(B2) |
申请公布日期 |
2003.06.24 |
申请号 |
US20010966093 |
申请日期 |
2001.10.01 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NAKAOKA YUKIKO;MATSUMURA KAZUHIKO;KANEKO HIDEYUKI;NAGAO KOICHI |
分类号 |
H01L23/28;H01L21/304;H01L21/56;H01L21/98;H01L23/12;H01L23/29;H01L23/31;H01L25/065;H01L25/07;H01L25/18;H01L29/06;(IPC1-7):H01L23/48;H01L29/40;H01L23/495;H01L23/52;H01L23/34 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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