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发明名称
MEASUREMENT OF METAL ELECTROPLATING AND SEED LAYER THICKNESS AND PROFILE
摘要
申请公布号
AU2002357225(A1)
申请公布日期
2003.06.23
申请号
AU20020357225
申请日期
2002.12.13
申请人
TIMBRE TECHNOLOGIES, INC.
发明人
XINHUI NUI;LAWRENCE LANE;NICKHIL JAKATDAR
分类号
G01B11/06;(IPC1-7):G01B11/00;G01R31/26
主分类号
G01B11/06
代理机构
代理人
主权项
地址
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