发明名称 PACKAGE FOR OPTICAL COMMUNICATION AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a package for optical communication and a method of manufacturing the same which prevents the creeping up of a low-temperature brazing material onto the top face side of a transmission substrate. SOLUTION: The package 10 for optical communication comprises a metal frame body 11 which forms a cavity section 14, and a metal adaptor consisting of a sidewall section 17 bonded to an installation section 15 and a base section 18. The side wall section 17 is formed with an insertion hole 20 for connecting a coaxial connector 19, and a ceramic transmission substrate 24, to which one side part of a connector core wire 23 projecting inside the cavity 14 is to be connected, is bonded to the base section 18 through a low-temperature brazing material 25. In a tapered section 28, a hollow via 27 provided with a metal conductor pattern 26d for establishing the continuity of metal conductor patterns 26b and 26c formed on the top face and the bottom face of the transmission substrate 24 is formed, with a metal thin film layer 29 for preventing the running out of the low-temperature brazing material 25 being formed on the metal conductor pattern 26d. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003174108(A) 申请公布日期 2003.06.20
申请号 JP20010373444 申请日期 2001.12.06
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 ITAKURA HIDEAKI;UENISHI TORU
分类号 G02B6/42;H01L21/60;H01L23/04;H01S5/022;(IPC1-7):H01L23/04 主分类号 G02B6/42
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