发明名称 MANUFACTURING METHOD FOR COMMUTATOR, MANUFACTURING EQUIPMENT FOR COMMUTATOR, MANUFACTURING METHOD FOR COMMUTATOR FORMING BOARD MATERIAL, MANUFACTURING EQUIPMENT FOR COMMUTATOR FORMING BOARD MATERIAL, COMMUTATOR FORMING BOARD MATERIAL, AND COMMUTATOR
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method for commutators which suppresses burrs and sags. SOLUTION: The commutator manufacturing method comprises a punching/ removing process for punching and removing a board material 12 having a plurality of protrusions 9 formed side by side in parallel, long in the direction of the side by side formation, by moving a first punch 14 in a direction reverse to that of protrusion of the protrusions 9. The punching/removing process has a positioning process for positioning and arranging the board material 12 on a lower metal die 13, and a punching process for punching the board material 12 placed on the die 13 with the first punch 14 which has recessions 15 corresponding to the protrusions 9, and has shrinking breadth portions 16 whose depths become deeper as they approach the transverse centers of the recessions 15 at positions corresponding to both corners of the protrusions 9 in the recessions 15. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003174757(A) 申请公布日期 2003.06.20
申请号 JP20020279168 申请日期 2002.09.25
申请人 ASMO CO LTD 发明人 TERADA YUICHI;SUGANO KAZUNOBU
分类号 H02K13/00;H02K15/02;(IPC1-7):H02K15/02 主分类号 H02K13/00
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