SYSTEM, METHOD AND PROGRAM FOR INSPECTING SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To perform noncontact and nondestructive pattern inspection of a semiconductor substrate subjected to CMP stably. SOLUTION: The system 1 for inspecting the pattern of a semiconductor substrate 9 comprises an optical head section 11 for acquiring the two-dimensional image of the pattern of the semiconductor substrate 9, and a computer 13 performing processing. The computer 13 is provided previously with a reference image and the reference histogram of its pixel value and pattern matching is performed between an acquired image and the reference image before the objective histogram of the pixel value of an acquired image is determined. Presence of a metal residual film is detected by determining the degree of similarity between the reference histogram and the objective histogram. COPYRIGHT: (C)2003,JPO