| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection device of a printed wiring board and its inspection method capable of measuring a characteristic impedance of the printed wiring board in a circuit area of a mounted article. SOLUTION: In this inspection device 1, the impedance of the printed wiring board 30 having plural conductive patterns (the second layer and the fifth layer) formed thereon exerting an influence on a wiring pattern (the third layer) to be measured is inspected. The device is characterized by having pins 2-4 to be brought into contact with the wiring pattern to be measured and the plural conductive patterns, and being equipped with a means for equalizing potentials of the plural conductive patterns. COPYRIGHT: (C)2003,JPO
|
