发明名称 METHOD OF WORKING QUARTZ MEMBER FOR PLASMA TREATMENT DEVICE, QUARTZ MEMBER FOR PLASMA TREATMENT DEVICE, AND PLASMA TREATMENT DEVICE MOUNTED WITH THE QUARTZ MEMBER
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of working quartz member for plasma treatment device by which occurrence of particles in an initial stage and occurrence of chipping thereafter can be suppressed, and to provide a quartz member for plasma treatment device and a plasma treatment device mounted with the quartz member. <P>SOLUTION: Many cracks 155 occurred in the quartz member 151 for plasma treatment device used for a shield ring, focus ring, etc., after diamond grinding are removed by polishing the surface of the member 151 with abrasive grains having a grain size of #320-400. Thereafter, a smashed layer 163 is removed while recessed and projected sections to which deposits can be adhered and which can hold the adhered deposits are maintained on the surface of the member 151 by polishing the surface of the member 151 with abrasive grains having a smaller grain size. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003174017(A) 申请公布日期 2003.06.20
申请号 JP20010332462 申请日期 2001.10.30
申请人 TOKYO ELECTRON LTD 发明人 SUGIYAMA TOMOKAZU;SAEGUSA HIDEHITO;OKAYAMA NOBUYUKI;IIMURO SHUNICHI;IMAFUKU KOSUKE;NAGAYAMA MASAYUKI;MIHASHI YASUSHI;NAKAYAMA HIROYUKI;KO AKI
分类号 H01L21/302;B44C1/22;H01L21/205;H01L21/3065 主分类号 H01L21/302
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