| 摘要 |
PROBLEM TO BE SOLVED: To provide a simple and highly reliable semiconductor device where the loading of a solder bump for outer electrode is not required. SOLUTION: A semiconductor element 3 is bonded to the center of a side where the conductor pattern 4 of a substrate 1 is formed. An aluminum bonding pad 6 formed on the surface of the semiconductor element 3, and a gold-plated bonding pad 5 on a conductor pattern 4-side are connected by ball-bonded metal wire 7. The substrate is set in upper/lower molds 9 and 10, where the semiconductor device is generated. The whole face of a side where the semiconductor element 3 is loaded is resin-sealed by sealing resin 8. Sealing pressure at the time of sealing resin is made strong enough to project the conductor pattern 4 to a through hole 2 side. The conductor pattern 4 is depressed to the through hole 2 side, and the prescribed quantity of it is projected at the time of sealing resin. COPYRIGHT: (C)2003,JPO
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