| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a fine pattern connection bump having the porous metal of high connection reliability. <P>SOLUTION: A part of the structure of the connection bump is formed of porous metal which easily crushes so that the height dispersion of the connection bump can be absorbed. The structure of the connection bump, where the connection of metal can be formed between the connection bumps, is formed. <P>COPYRIGHT: (C)2003,JPO |
