| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the structure of a semiconductor package which can seal a semiconductor chip without using a private mold, which does not give damage to a semiconductor chip at the time of packaging, and which is fitted to thinning, and to provide the method of packaging. <P>SOLUTION: The semiconductor chip is arranged on a base material and a sheet is arranged on the base material and the semiconductor chip. Pressure between the base material and the sheet is dropped and the sheet is closely brought into contact with the base material and the semiconductor chip. The base material and the sheet are bonded and the base material and the sheet are simultaneously cut at the periphery of the semiconductor chip. In the semiconductor package, the base material and the sheet are bonded at the periphery of the semiconductor chip, and the terminal face of the base material and that of the sheet are on the same face on at least one side of the semiconductor package. <P>COPYRIGHT: (C)2003,JPO</p> |
