| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming external electrodes of a semiconductor device capable of easily forming external electrodes that are exposed on a sealing-resin surface. SOLUTION: Resin material 5 is loaded on the upper face of a lower mold 12 while the object 4 to be molded is arranged between an upper mold 14 and a lower mold 13. After the resin material 5 is heated to be melted, the total of the lower mold 13 is raised to clamp the peripheral part of the object 4 to be molded. By raising the movable lower mold 12 to apply a compressive force to bump electrodes 3 and the melted resin 5, resin molding of the object 4 to be molded is performed while the bump electrodes 3 are squeezed to a specific height. By squeezing the bump electrodes 3 to reduce their height by about 5-50% of the height at their formation, the top-end surfaces of the bump electrodes 3 after the resin molding are surely exposed on the resin surface. COPYRIGHT: (C)2003,JPO |
