| 摘要 |
PROBLEM TO BE SOLVED: To provide an stable electroless gold plating method which is operated at a lower temperature. SOLUTION: The electroless gold plating composition contains (a) one or more water soluble gold compounds; (b) one or more gold complexing agents; and (c) one or more organic stabilizer compounds of the formula: R-SO<SB>2</SB>-Y wherein R is a 1-18C alkyl, aryl, or heteroaryl, and Y is hydrogen or a univalent cation; and (d) one or more agents for improving uniformity. COPYRIGHT: (C)2003,JPO |
