| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a pitch conversion technology of substrates suitable for batch type cleaning equipment for cleaning substrates while converting the pitch of substrates arranged to face the surfaces with each other to be larger than the pitch of substrates arranged to face the rear surfaces with each other. <P>SOLUTION: Adjacent substrates are arranged to face the surfaces with each other and to face the rear surface with each other and the pitch of substrates arranged to face the rear surfaces with each other are set smaller than a normal pitch of arrangement. Since the pitch can be converted such that the pitch of substrates arranged to face the surfaces with each other becomes larger than the pitch of substrates arranged to face the rear surfaces with each other, particles or the like can be prevented from leaking from the rear surface to the surface of a wafer at the time of cleaning the substrate and cleaning effect is enhanced between the wafer surfaces while reducing the size of the processing bath. <P>COPYRIGHT: (C)2003,JPO</p> |
