发明名称 MANUFACTURING METHOD OF PRINT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide the manufacturing method of a print substrate capable of improving a positional accuracy by correctly aligning a transfer film and capable of improving the consistency of positions among wiring patterns of respective layers. SOLUTION: The manufacturing method of the print substrate constituted of a plurality of layers of wiring patterns 60 and insulation layers 44 which are alternately formed on the surfaces of the core members 2 comprises a process for forming new insulation layers on the whole of the surfaces; a process for forming reference non- penetrating holes 28, 46 by laser beam L1 so as to arrive at a lower layer, while referencing an immediately below wiring pattern at a position not being superposed on the wiring pattern of a lower layer in a pattern forming area 7 on the new insulation layers; a process for forming a conductive layer on the insulation layer so that a positioning recess 32 can be formed above the reference non-penetrating holes; a process for aligning and fixing the transfer films 38, 46, on which a predetermined circuit pattern is recorded, based on the positioning recess for the register layer formed on the new insulation layer; and a process for forming the wiring pattern of an upper layer by making a pattern through the transferring of the circuit pattern of the transfer film on the conductive layers 30, 48. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003174256(A) 申请公布日期 2003.06.20
申请号 JP20010370479 申请日期 2001.12.04
申请人 VICTOR CO OF JAPAN LTD 发明人 MATSUBAYASHI YOSHITERU;MICHIWAKI SHIGERU;SUGA SHINJI;TADA JUNICHI
分类号 H05K3/06;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/06
代理机构 代理人
主权项
地址
您可能感兴趣的专利