| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for an SOI wafer which can carry out a combining process for 1st and 2nd wafers extremely efficiently and make an SOI wafer obtained by sticking them hard to have a decrease or variance in quality. SOLUTION: A plurality of pairs of 1st wafers 101 and 2nd wafers having their suck surfaces opposite each other in the form of a 1st wafer array body 120 are prepared, and the suck surfaces of the couples of wafers of the 1st wafer array body 120 are stacked together at a time to obtain a 2nd wafer array body 121. The wafers are all stacked at a time by conversion from the 1st wafer array body 120 to the 2nd wafer array body 121, which is extremely efficient. Further, the wafer pairs 108 in the 1st wafer array body 120 have nearly no time difference when stuck together, so they hardly have qualitative differences or variance. COPYRIGHT: (C)2003,JPO
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