| 摘要 |
PROBLEM TO BE SOLVED: To absorb a stress due to expansion and shrinkage caused by a change in temperature of different materials or increase the connection strength, when soldering a ceramic substrate to a printed wiring board. SOLUTION: A module is such that an electronic component is mounted on a ceramic substrate 1, and is to be surface-mounted on a printed wiring board 7. In the module, L-shaped lead terminals 3 to be connected to a circuit pattern of the printed wiring board 7 are installed in input and output electrode sections 4 of the module using solder. The L-shaped lead terminals 3 are formed of silver-plated wires or solder-plated wires which are formed in an L shape, and absorb a stress due to expansion and shrinkage. COPYRIGHT: (C)2003,JPO
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