| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which is used for prepregs and laminates and can give the laminates having high moisture resistance and soldering heat resistance after moisture absorption. SOLUTION: This resin composition at least comprises (A) a polymaleimide compound represented by formula [1], (B) an epoxy resin having at least two glycidyl groups, in a molecule, (C) a phenol resin having at least two OH groups in a molecule, and (D) an aromatic condensed phosphate. Based on 100 pts.mass sum of ingredients (A), (B), (C), and (D), the composition contains at least 2.5 pts.mass ingredient (A) in terms of nitrogen element and at least 0.3 pt.mass ingredient (D) in terms of phosphorus element. COPYRIGHT: (C)2003,JPO
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