| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure which can be reduced in size by simple manufacturing processes, and also to provide a method of manufacturing the same which enables a remarkable increase in production efficiency. <P>SOLUTION: The semiconductor device comprises a semiconductor chip 1a provided, on one principal plane, with a semiconductor circuit having specified functions and an electrode 3, a wire 2 with one end connected to the electrode 3 and having a connection terminal 2a for external connection on the other end, and an insulator for covering at least one principal plane of the semiconductor chip. The connection terminal 2a provided on the other end of the wire 2 is formed, being integrated with the other parts of the wire, and is exposed on the bottom face of the insulator which is on the opposite side from the top face of the insulator on one principal plane side. <P>COPYRIGHT: (C)2003,JPO |
