| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the component density in three-dimensional packaging wherein semiconductor devices are embedded between a plurality of substrates. <P>SOLUTION: A semiconductor device 1 is such that circuit elements are formed on a semiconductor substrate 10 and members 11a and 11b for forming conductivity paths are formed from the front face over to the rear face of the semiconductor substrate 10. A method of manufacturing the semiconductor device 1 comprises a process of forming the circuit elements on the semiconductor substrate 10 and a process of connecting the members 11a and 11b for forming conductivity paths from the front face over to the rear face through side faces of the semiconductor substrate 10. An electronic circuit device is such that the semiconductor devices 1 are embedded between a plurality of substrates, each formed with a conductor pattern, with each of the semiconductor devices 1 formed with members 11a and 11b for forming conductivity paths which are used for establishing electrical connection between the conductor patterns of the plurality of substrates. <P>COPYRIGHT: (C)2003,JPO |
