发明名称 COMPOSITION FOR SEALING, JOINT BODY AND ELECTROCHEMICAL DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a composition for sealing, which can maintain sealing performance under conditions where it is exposed to oxidizing, reducing matters in a high temperature range and also to a heating cycle between a low temperature and a high temperature. <P>SOLUTION: The composition for sealing contains 2 to 15 weight percent of BaO, 35 to 48 percent of CaO, 2 to 15 weight percent of Y<SB>2</SB>O<SB>3</SB>and 40 to 50 weight percent of Al<SB>2</SB>O<SB>3</SB>. Or, it contains 2 to 10 weight percent of MgO, 35 to 48 weight percent of CaO, 5 to 20 weight percent of Y<SB>2</SB>O<SB>3</SB>, and 40 to 45 weight percent of Al<SB>2</SB>O<SB>3</SB>. Or, thermal expansion coefficient of materials constituting object members for sealing is 8&times;10<SP>-6</SP>/K or more and 12&times;10<SP>-6</SP>/K or less, when the composition for sealing contains 5 to 20 weight percent of SrO, 35 to 45 weight percent of CaO, 2 to 15 weight percent of Y<SB>2</SB>O<SB>3</SB>, and 40 to 50 weight percent of Al<SB>2</SB>O<SB>3</SB>. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003173800(A) 申请公布日期 2003.06.20
申请号 JP20010371357 申请日期 2001.12.05
申请人 NGK INSULATORS LTD 发明人 ITO SHIGENORI;OKUMURA KIYOSHI;KAWASAKI SHINJI
分类号 C04B37/00;C04B37/02;H01M8/02;H01M8/12 主分类号 C04B37/00
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