发明名称 HIGH FREQUENCY PRINTED WIRING BOARD, AND HIGH FREQUENCY MULTI-LAYERED PRINTED WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To obtain a high frequency printed wiring board capable of preventing a signal from being reflected owing to a change in characteristic impedance of a conductor pattern to reduce transmission loss. <P>SOLUTION: On a board 1, there are provided first and second conductor patterns 2a, 2b at a predetermined interval between one ends thereof; a printed resistor 4 connected between the one ends of the first and second conductor patterns 2a, 2b; and printed resistor forming mold parts, in which a pair thereof are provided along a part other than the first and second conductor patterns 2a, 2b on the board 1 such that they have substantially the same size as a height from a portion on the board 1 to the top of a printed resistor 4, and come into contact with two side surfaces of the printed resistor 4 in an outer periphery of the same excepting a connection portion between the first and second conductor patterns 2a, 2b, and further they employ a solder resist 3 comprising an epoxy resin restricting the configuration of the printed board 4. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003174244(A) 申请公布日期 2003.06.20
申请号 JP20010374778 申请日期 2001.12.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 ISOBE YOSHIAKI
分类号 H05K1/16;H05K1/02;H05K3/28;H05K3/46;(IPC1-7):H05K1/16 主分类号 H05K1/16
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