| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can easily realize accurate positioning on the occasion of stacking semiconductor devices and can surely attain stand-off at the time of mounting into a substrate. SOLUTION: The semiconductor device is provided with a resin package having two external surfaces which are provided opposed to each other to cover a semiconductor chip. One external surface of the semiconductor device includes the projected part of the shape which becomes narrower as it goes to the end point, while the other external surface includes the recessed part of the shape to which a projected part of the same shape as the projected part may be inserted. COPYRIGHT: (C)2003,JPO
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