METHOD OF SELECTIVELY ETCHING SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method of etching a thin-film circuit in a quite efficient manner while ensuring etching selectivity when the thin-film circuit is formed on a semiconductor substrate, without causing any corrosion on a switching element or a wiring material which are used for the semiconductor substrate and the thin-film circuit. SOLUTION: When a conductive thin film is etched, etching is selectively performed by using an etching solution made of an oxidizing agent and a chelating agent. COPYRIGHT: (C)2003,JPO