| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating device that can reduce the feed rate of an inert gas, such as nitrogen gas, by surrounding the whole surface to be treated of a substrate with an atmosphere of the inert gas and, at the same time, preventing formation of a turbulent flow of the inert gas in the periphery of the substrate. SOLUTION: This substrate treating device is provided with a substrate holding section 1 which rotates the substrate W while holding the substrate W, a first treating liquid supply section 3 which supplies a treating liquid to the surface to be treated of the substrate W held by the holding section 1, and an inert gas supply section 2 which is provided over the holding section 1 and forms a down flow of the inert gas so as to cover the whole surface to be treated of the substrate W. This device is also provided with a housing 5 housing the holding section 1, first treating liquid supply section 3, and inert gas supply section 2. COPYRIGHT: (C)2003,JPO
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