| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in resistance to soldering heat and good in flame retardancy and a semiconductor device using the same. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin described by the formula, (B) a phenol resin, (C) an inorganic filler, and (D) an amino-based silane coupling agent and the semiconductor device manufactured by using the same is provided. In the formula, n is an integer of zero, one, or greater. COPYRIGHT: (C)2003,JPO
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