| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component and a method of assembling the same which is capable of stabilizing a product quality and reducing a packaging cost including shortening the production tact time. <P>SOLUTION: After coating a circuit formation section 113 with a sealing material 114, the sealing material is removed until bumps 112 are exposed. By this method, no damage is given to the circuit formation section and thereby a product quality can be stabilized. Unlike the conventional case, no package with a special shape is necessary and a process of placing a cover is not necessary, either, resulting in the reduction in a packaging cost including shortening the production tact time. <P>COPYRIGHT: (C)2003,JPO |
