| 摘要 |
PROBLEM TO BE SOLVED: To securely connect a solid-state imaging element and to improve the adhesion quality of sealing glass of an optical filter, etc., by suppressing thermal deformation of a resin structure such as a solid printed board. SOLUTION: The device is equipped with a structure 1 which is made of an insulating resin composed of a thermoplastic resin and has a through opening part 1C and has a wiring part 5 on the surface, a solid-state imaging element 4 which is connected to a wiring part and mounted on the through opening part 1C, and a translucent member 3 which is arranged at a specific interval with the solid-state imaging element 4 so as to close the through opening part 1C. The structure 1 has boundary surfaces which differ in molecular bonding direction at positions which are nearby the solid-state imaging element mount surface 9 and parallel to the mount surface 9 for the solid-state imaging element 4. COPYRIGHT: (C)2003,JPO
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