发明名称 BOARD FOR HEATING AND TATAMI MAT FOR FLOOR HEATING USING IT
摘要 PROBLEM TO BE SOLVED: To provide a board for heating, by which heat can be transmitted approximately uniformly from the whole board body and which can be manufactured at low cost comparatively easily. SOLUTION: The board for heating is used for heating by utilizing heat from a heating means. The board for heating has board bodies 104 for transmitting heat from the heating means, and thermal conductive materials 106 having excellent thermal conductivity are mixed uniformly with the board bodies 104 substantially. According to such constitution, heat is transferred from one surface sides of the board bodies 104 to the other surface sides mainly by the thermal conductive materials 106, and heat is transferred approximately equally through the whole board. Aluminum, copper, tin or the like is used as the thermal conductive material 106. The board for heating can be applied favorably as a board for a hot water type floor heating apparatus and an electric type floor heating apparatus. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003172016(A) 申请公布日期 2003.06.20
申请号 JP20020267683 申请日期 2002.09.13
申请人 OTSUBO TADASHI 发明人 OTSUBO TADASHI
分类号 E04F15/02;E04F15/18;F24D19/00;(IPC1-7):E04F15/02 主分类号 E04F15/02
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