| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of positioning dot marks formed on a semiconductor wafer and a positioning unit, which is capable of accurately performing a precise optical processing on a desired marking region of the peripheral area of a wafer. <P>SOLUTION: A lighting unit 41 irradiates a part of the peripheral area of a wafer W with light, and an image pickup device 42 is arranged in a direction different from the direction of irradiation to image and picturize the sectional shape of the peripheral area of the wafer W where dot marks are formed. Which part of the peripheral area 10 of the wafer to be processed or read is determined to the imaged sectional picture image. Then, a positional difference between a picture image, which is corresponding to an image forming position of a processing system 20 and displayed on the same image screen with the sectional picture, is calculated, and a relative moving means 30 is controlled and moved, corresponding to the position coordinates of the picture image. The determined dot mark forming position is made mechanically matched with the image forming position of the processing system 20. At this point, the focal point of the processing system 20 is precisely adjusted so as to be automatically focused, and desired processing can be performed at a dot mark forming position. <P>COPYRIGHT: (C)2003,JPO</p> |
