RESIST REMOVING COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To reliably remove a resist and polymer residue and to minimize damage to wiring. SOLUTION: After a metallic film or a semiconductor film on a semiconductor substrate is dry-etched to form a wiring layer having a prescribed pattern or after an insulating layer is formed on a semiconductor substrate with a formed wiring layer and dry-etched in a prescribed pattern, chemical treatment is carried out with a resist removing composition prepared by adding a sugar alcohol to a composition comprising a fluorine compound, an organic solvent and water. The pH of the resist removing composition is adjusted to≥8. Xylitol may be used as the sugar alcohol. COPYRIGHT: (C)2003,JPO