| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is entirely formed in small thickness with excellent heat radiation effect of semiconductor element by forming the semiconductor element and lead section in the same plane. SOLUTION: A semiconductor chip 21 comprises a semiconductor element 22, a lead frame including a plurality of leads 23 extending toward this semiconductor element 22 and a resin material 25 for sealing the semiconductor element 22 and the leads 23. In this semiconductor chip 21, the semiconductor element 22 and leads 23 are allocated on the same plane, element electrodes 27 of the semiconductor element and leads 23 are electrically connected on the same plane via a bonding wire 24, and the rear surface of the semiconductor element 22 and leads 23 are exposed at the rear surface side of the resin material 25. COPYRIGHT: (C)2003,JPO
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