SYSTEM, METHOD AND PROGRAM FOR INSPECTING SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To perform noncontact and nondestructive pattern inspection of a semiconductor substrate subjected to CMP stably. SOLUTION: The system 1 for inspecting the pattern of a semiconductor substrate 9 comprises an optical head section 11 for acquiring the two-dimensional image of the pattern of the semiconductor substrate 9, and a computer 13 performing processing. The computer 13 is provided previously with a reference image and its edge image and pattern matching is performed between an acquired image and the reference image in order to determine a difference image. In the difference image, mean absolute pixel value is compared with a specified threshold value while excluding an edge region represented by the edge image thus detecting presence of a metal residual film. COPYRIGHT: (C)2003,JPO