发明名称 POLYOXYMETHYLENE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a polyoxymethylene resin composition extremely high in thermal stability, good in moldability, less in foreign matter generation, and excellent in external appearance. SOLUTION: The polyoxymethylene resin composition is prepared by compounding (B) 0.01-10 pts.wt. of a heat stabilizer having a triazine structure containing an amino group to (A) 100 pts.wt. of a polyoxymethylene resin. The heat stabilizer is a reaction product of formaldehyde containing 2.0 wt.% or less of free formaldehyde content with a triazine compound containing an amino group and/or a derivative wherein the methylol groups bonded to the amino groups in the reaction product are partially or wholly alkylated. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003171528(A) 申请公布日期 2003.06.20
申请号 JP20010372984 申请日期 2001.12.06
申请人 TORAY IND INC;KTP:KK 发明人 TOGAWA MITSUNARI;KARASAWA HIROO;NISHIMURA TORU;TOKIMINE KUNIO;KIN FUKUSHU
分类号 C09K15/30;C08K5/3492;C08L59/00;(IPC1-7):C08L59/00;C08K5/349 主分类号 C09K15/30
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