| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component with leads which can improve holding force of the leads after a resin package has been hardened and does not easily generate break of wires and peeling of the leads. SOLUTION: The electronic component with leads comprises mounting sections 5, 6 to mount elements 2 to 4, a resin package 7 covering the mounting sections 5, 6, and lead sections 8 to 14 where the base end section thereof is embedded within the resin package 7 and connected to the mounting sections 5, 6 in direct or via a bonding wire 15, while the end section thereof is projected to the external side from the resin package 7. In the electronic component with leads 1, a different shape section 16 including a hole or a cutout portion is provided to the base sections of the lead sections 8 to 14 where the end sections are mechanically processed among the lead sections 8 to 14. Since the different shape section 16 is provided, the holding force of the lead sections 8 to 14 formed of resin can be increased. COPYRIGHT: (C)2003,JPO |
