发明名称 MULTILAYER WIRING CIRCUIT SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To prevent the generation of high-frequency noise in a power supply by a method wherein a capacitor for removing the high-frequency noise generated in the power supply is made unnecessary to lower the inductance of a circuit itself, in a multilayer wiring circuit substrate. <P>SOLUTION: When a parts mounting surface or the uppermost surface layer is specified as a first layer, one side of a ground layer and the same of a power supply layer are arranged on a second layer while the other sides of them are arranged on a third layer, and an insulation film is arranged between the ground layer and the power supply layer. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003174265(A) 申请公布日期 2003.06.20
申请号 JP20020182048 申请日期 2002.06.21
申请人 FUJITSU LTD 发明人 KUSAYA TOSHIHIRO;YONEDA YASUHIRO;MIZUTANI DAISUKE;IIJIMA KAZUHIKO;SUWA YUJI
分类号 H05K1/02;H05K1/11;H05K3/00;H05K3/46 主分类号 H05K1/02
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