发明名称 HOLDING STRUCTURE FOR ELECTRONIC PARTS AND HOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a holding structure for electronic parts and holding method capable of improving the accuracy of positioning electronic parts. SOLUTION: A mold 24 is insert-molded with reference of a terminal 23. The mold 24 has a cup shape 24a for positioning shape of Hall IC 22 electrically connected with the terminal 23. A connector housing 21 surrounding the mold 24 and the Hall IC 22 positioned to the mold 24 and electrically connected with the terminal is insert-molded with reference of the terminal 23. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003172634(A) 申请公布日期 2003.06.20
申请号 JP20010371774 申请日期 2001.12.05
申请人 AISIN SEIKI CO LTD;TOYOTA MOTOR CORP 发明人 YASUDA TAKASHI;KIMURA MASAHIRO;OKUYA HISAYOSHI;YADA HIDETOSHI;ITO HIROYOSHI;NISHIGUCHI MASAYUKI;MIZUNO NAOKI
分类号 G01D5/14;H05K5/00;(IPC1-7):G01D5/14 主分类号 G01D5/14
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