发明名称 |
Fixed abrasive polishing pad |
摘要 |
Apparatuses and methods are disclosed using a fixed abrasive polishing pad to perform mechanical polishing of a surface. The apparatus includes a polishing pad positioned opposing a wafer support to provide for polishing of a surface of a wafer placed on the support. The polishing pad includes a first member having a first polishing surface formed from an abrasive first material that is structurally degradable during polishing. The polishing pad also includes a second member having a second polishing surface formed from a second material that is less degradable and less abrasive relative to said first material. The first and second polishing surfaces define a polishing face that is brought into contact with the surface to be polished. Preferably, a portion of the second member can be removed from the polishing pad so that the first polishing surface extends beyond the second polishing surface to provide for a fixed amount of abrasion using the first member prior to the second member contacting the surface and substantially reducing or stopping the polishing process.
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申请公布号 |
US2003114088(A1) |
申请公布日期 |
2003.06.19 |
申请号 |
US20030352668 |
申请日期 |
2003.01.28 |
申请人 |
WALKER MICHAEL A.;ROBINSON KARL M. |
发明人 |
WALKER MICHAEL A.;ROBINSON KARL M. |
分类号 |
B24B7/22;B24B37/04;B24D11/00;B24D13/14;(IPC1-7):B24B1/00;B24B7/19 |
主分类号 |
B24B7/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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