METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method of manufacturing a semiconductor device is provided to improve contact between two lines by forming a via having a multi-layered structure. CONSTITUTION: The first via(32) being in contact with the first line is formed on a substrate(10) having the first line. The first interlayer dielectric(40) is deposited on the substrate and planarized. The second via(52) to be in contact with the fist via is formed on the first interlayer dielectric. The second interlayer dielectric(60) is deposited on the substrate having the second via and planarized. The second line is formed on the second interlayer dielectric to contact the second via.