METHOD FOR PREVENTING POLLUTION IN BACK SIDE GRINDING OF WAFER

摘要

PURPOSE: A method for preventing pollutions in a semiconductor device is provided to be capable of preventing the pollutions due to silicon particles caused by polishing back side grinding of a silicon wafer. CONSTITUTION: A silicon wafer is provided with a plurality of dies(1) due to a scribe line(3). A passivation layer is formed on the dies(1) to expose a pad(2). After attaching a tape on the front surface of the silicon wafer, the rear surface is polished. At this time, in order to prevent pollutions of the pad(2) due to silicon particles, a dummy pattern(40) is also formed on the scribe line(3) adjacent to edge portions of the wafer when forming the passivation layer.