| 摘要 |
<p>A method and system for measuring metal electroplating barrier and seed layer thickness and profile. Using optical metrology(210), profiles of post-barrier deposition grating and post-seed deposition grating(220) can be measured non-destructively. In turn, the thickness and profile of the barrier layer can be determined by subtracting the profile of the post-barrier deposition grating from the profile of the substrate damascene grating(240). Similarly, the thickness and profile of the seed layer can be determined by subtracting the profile of the post-seed deposition gratin from the profile of the post-barrier deposition grating.</p> |
