| 摘要 |
An electrical connection device comprises a socket, a plurality of electrical conducting holder in between, a contact ring and a plurality of solder balls. A plurality of pin holes are placed on the socket to provide the insert function for the pins of a IC package. The electrical conducting holder is placed in the pin holes and comprises an extensional part, a holder on the top of the extension part and a solder pad on the bottom part of the extension part to combine the solder ball. At least one 2D or 3D geometrical structure such as the hole, the convex and concave part or the slope on the bottom surface of the solder pad is formed. The geometrical structure will make the bottom surface of the solder pad not the flat plane. With the geometrical structure and the contact ring, the contact area of the solder pad and the contact ring will be enlarged during the solder reflow process. The coupling effect will be better and meanwhile improve the characteristics of the electricity, the intensity of the structure, the production yield and the characteristics of the co-planarity. |
