发明名称 |
Method of forming tapered electrodes for electronic devices |
摘要 |
In the method, a substrate is coated with different films to be patterned. These films have different etch rates. The films and substrate are then coated with a primary etch mask, and subsequently patterned to produce an electrode that has a gradual taper at the electrode edge. The formed electrode eliminates any abrupt substrate to electrode step, so that any subsequent thin-film deposition of piezoelectric material is continuous over the entire electrode surface and the electrode/substrate interface.
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申请公布号 |
US2003111439(A1) |
申请公布日期 |
2003.06.19 |
申请号 |
US20010021881 |
申请日期 |
2001.12.14 |
申请人 |
FETTER LINUS ALBERT;TAKAHASHI KEN MATTHEW |
发明人 |
FETTER LINUS ALBERT;TAKAHASHI KEN MATTHEW |
分类号 |
H01B13/00;H01L21/461;H01L41/22;H03H3/02;(IPC1-7):H01L21/461 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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