发明名称 Method of forming tapered electrodes for electronic devices
摘要 In the method, a substrate is coated with different films to be patterned. These films have different etch rates. The films and substrate are then coated with a primary etch mask, and subsequently patterned to produce an electrode that has a gradual taper at the electrode edge. The formed electrode eliminates any abrupt substrate to electrode step, so that any subsequent thin-film deposition of piezoelectric material is continuous over the entire electrode surface and the electrode/substrate interface.
申请公布号 US2003111439(A1) 申请公布日期 2003.06.19
申请号 US20010021881 申请日期 2001.12.14
申请人 FETTER LINUS ALBERT;TAKAHASHI KEN MATTHEW 发明人 FETTER LINUS ALBERT;TAKAHASHI KEN MATTHEW
分类号 H01B13/00;H01L21/461;H01L41/22;H03H3/02;(IPC1-7):H01L21/461 主分类号 H01B13/00
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