Heat-dissipating substrate, method for making the same, and semiconductor device including the same

摘要

A heat-dissipating substrate is made of a composite material comprising a first composition primarily composed of aluminum and a second composition primarily composed of silicon carbide and/or silicon The heat-dissipating substrate has a recess in one of its main faces. The main faces have fine unevenness, and the maximum amplitude of the fine unevenness in the depth direction of a main face is smaller than the maximum length in the depth direction of composite particles comprising the first composition and the second composition or particles of the second composition, the particles being exposed at the surface of the main face.